发明名称 Integrated DC/DC converter substrate connections
摘要 Embodiments of the present invention provide an integrated circuit (IC) having an integrated DC-DC power converter therein. This IC is operable to support the distribution of combined power and data signals in a network environment such as an Ethernet network according to protocols such as the power over Ethernet (PoE) protocol. The IC includes a DC-DC power converter, a power feed circuit, and a network physical layer (PHY) module, wherein the PHY module may contain fine line structures susceptible to damage when exposed to excessive voltages. To prevent or reduce the likelihood of damage to the PHY module from voltages supplied to the DC-DC power converter, a common substrate ground is shared between the IC components.
申请公布号 US2006214253(A1) 申请公布日期 2006.09.28
申请号 US20050282804 申请日期 2005.11.18
申请人 AKROS SILICON, INC. 发明人 CAMAGNA JOHN R.;GHOSHAL SAJOL
分类号 H01L29/00 主分类号 H01L29/00
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