PLASMA PROCESSING APPARATUS

摘要

Disclosed is a film-forming apparatus which enables to suppress generation of particles and to reduce the workload of the cleaning process. Specifically disclosed is a film- forming apparatus for forming a thin film (15) on a substrate (6) by supplying a gas (13) through a gas nozzle (14) into a vacuum chamber (1) and transforming the gas (13) into a plasma by applying a current to a high-frequency antenna (7). In this film-forming apparatus, a ceramic inner cylinder (20) is so arranged that only a small area of the cylinder is in contact with the vacuum chamber (1) for preventing adhesion of the film-forming component onto the inner wall of the vacuum chamber (1).