发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR INTERLAYER INSULATION FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for an interlayer insulation film having excellent heat resistance. <P>SOLUTION: The photosensitive resin composition contains an alkali-soluble resin component (A) and a photosensitizing agent (B), wherein the component (A) contains a resin component (A1) having a constitutional unit (a1) represented by formula (a1) wherein R<SP>0</SP>represents H or methyl; R<SP>1</SP>represents a single bond or a 1-5C alkylene group; R<SP>2</SP>represents a 1-5C alkyl group; a represents an integer of 1-5; b represents 0 or an integer of 1-4; a+b&le;5; and when two or more symbols R<SP>2</SP>are present, these may be mutually different or the same. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006259083(A) 申请公布日期 2006.09.28
申请号 JP20050074858 申请日期 2005.03.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TATENO ISAO
分类号 G03F7/023;C08F20/30;G03F7/004 主分类号 G03F7/023
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