| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device of LGA structure where an impedance of power source is reduced and a package is downsized. SOLUTION: In the semiconductor integrated circuit device of LGA (land grid array) structure, a semiconductor integrated circuit chip is mounted on the substrate surface side, lands composing a signal terminal are located on the substrate back side in grid, and electrodes composing a power source terminal for providing a power source voltage and a ground potential are located on both sides of the substrate, respectively. COPYRIGHT: (C)2006,JPO&NCIPI |
