| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of preventing the deterioration of an insulating property. SOLUTION: An insulating layer 1 is prepared in which insulating layers 1a, 1c (hereinafter called thin-film insulating layers) composed of thermoplastic polyimides are formed on both surfaces of a base insulating layer 1b composed of a thermosetting polyimide film. Specified conductor patterns 2 each having a thickness of 5 to 50μm, preferably 5 to 20μm are formed on the thin-film insulating layer 1a of the insulating layer 1 by copper electroplating. Intervals among the conductor patterns 2 are less than 100μm. A reinforcing layer 4a having a thickness of 5 to 50μm, preferably 10 to 30μm for reinforcement is formed on the thin-film insulating layer 1c through an adhesive layer 3a having a thickness of 5 to 50μm, preferably 10 to 20μm. The conductivity of the adhesive layer 3a formed on the thin-film insulating layer 1c is set at decuple or less of the conductivity of the insulating layer 1. COPYRIGHT: (C)2006,JPO&NCIPI
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