| 摘要 |
PROBLEM TO BE SOLVED: To provide a cap member and an optical semiconductor device which are capable of preventing damage to a window member. SOLUTION: The cap member C1 seals an optical semiconductor device with an optical semiconductor element fixed thereto. The member C1 comprises an annular frame body 10, a transparent window member 11 arranged in a hole to blockade the hole of the frame body, and an adhesive member 12 positioned between the inner wall surface of the hole and the outer peripheral surface 11c of the window member 11 to bond the inner wall surface of the hole to the outer peripheral surface of the window member 11. The thermal expansion coefficient of the frame body 10 is larger than those of the window member 11 and the adhesive member 12. A rim between the lower side surface 11a as the inside surface of the window member 11 and the outer peripheral surface, and between the upper side surface 11b as the outside surface of the window member 11 and the outer peripheral surface is projected toward the direction of the thickness of the window member from a part with the adhesive member 12 bonded thereto on the outer peripheral surface thereof. COPYRIGHT: (C)2006,JPO&NCIPI
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