| 摘要 |
In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting includes supplying solder paste containing Au-Sn series solder particles onto the substrate, putting the semiconductor element having a film of an Sn alloy or Sn formed on the bonding electrode on the solder paste, and melting the Au-Sn series solder particles and the film of the Sn alloy or Sn to bond the semiconductor element to the substrate. |
