SPHERICAL SILICA PARTICLE, RESIN COMPOSITION AND SEMICONDUCTOR LIQUID SEALING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a spherical silica particle suitable for a resin composition used in a semiconductor package or the like. SOLUTION: Group 13 elements such as an aluminum element which are generally recognized as impurities in the spherical silica particle and may be considered to be preferably removed as much as possible exhibit not only actions of lowering viscosity in a resin composition but also exhibit no adverse effect even when the silica particles are applied as a sealing medium in a semiconductor package. The spherical silica particle of the present invention contains≤0.5 ppb uranium element by mass and≥40 ppm and less than 410 ppm one or more kinds of additive elements selected among group 13 elements in the periodic table and whose sphericity is≥0.8. COPYRIGHT: (C)2006,JPO&NCIPI