发明名称 |
Optimized circuits for three dimensional packaging and methods of manufacture therefore |
摘要 |
An apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a first substrate and a second portion of the integrated circuit is placed on a second substrate stacked adjacent the first substrate and wherein the first portion and the second portion of the integrated circuit are interconnected.
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申请公布号 |
US2006214165(A1) |
申请公布日期 |
2006.09.28 |
申请号 |
US20060353930 |
申请日期 |
2006.02.14 |
申请人 |
MACROPOULOS WILLIAM;MENDOLIA GREG;OAKES JAMES G;KHAYO IZZ |
发明人 |
MACROPOULOS WILLIAM;MENDOLIA GREG;OAKES JAMES G.;KHAYO IZZ |
分类号 |
H01L29/04 |
主分类号 |
H01L29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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