发明名称 High performance field effect transistors on SOI substrate with stress-inducing material as buried insulator and methods
摘要 The present invention provides a semiconductor structure that includes a high performance field effect transistor (FET) on a semiconductor-on-insulator (SOI) in which the insulator thereof is a stress-inducing material of a preselected geometry. Such a structure achieves performance enhancement from uniaxial stress, and the stress in the channel is not dependent on the layout design of the local contacts. In broad terms, the present invention relates to a semiconductor structure that comprises an upper semiconductor layer and a bottom semiconductor layer, wherein said upper semiconductor layer is separated from said bottom semiconductor layer in at least one region by a stress-inducing insulator having a preselected geometric shape, said stress-inducing insulator exerting a strain on the upper semiconductor layer.
申请公布号 US2006214225(A1) 申请公布日期 2006.09.28
申请号 US20050088595 申请日期 2005.03.24
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HOLT JUDSON R.;OUYANG OIGING C.
分类号 H01L29/06;H01L21/46 主分类号 H01L29/06
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