| 摘要 |
A space is largely defined inside of a lid 14, thus enhancing the freedom of a design of members to be contained inside of the lid 14. An airtight container 11 includes a container unit 12 which contains therein a plurality of semiconductor wafers W, the lid 14 which closes the container unit 12, and a seal 74 which air-tightly seals a clearance defined between the container unit 12 and the lid 14. A support groove 41 is formed at an inside plate 30 A of the lid 14 so as to support the semiconductor wafers W one by one. The support groove 41 is formed at the inside plate 30 A of the lid 14 in such a manner as to be opened toward the container unit 12, and is constituted of a slit, at and into which the semiconductor wafers are fitted and supported one by one. A V-shaped groove 42 is formed at the bottom of the support groove 41. A support groove 61 having another configuration includes a relief groove 62 formed at the inside plate 30 A, and a thin plate supporter 63 which is disposed in a manner corresponding to the relief groove 62 in a thin plate supporting space S defined between a cover plate 65 and the inside plate 30 A, so as to support one by one the semiconductor wafers W fitted into the relief groove 62.
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