发明名称 METHOD AND SYSTEM FOR PLASMA TREATMENT UNDER HIGH PRESSURE
摘要 A method and system is provided for plasma treatment of material (202) at high pressure. The system used comprises a plasma generating means which comprises at least a first electrode (206) and a second electrode (208) for generating a plasma (204) pinned between the first electrode (206) and the second electrode (208) and a means (210) for displacing part of the plasma (204) towards a treatment area of said material (202). In this way the plasma (204) and the material (204) can interact, whereby the corresponding plasma current is substantially parallel with the treatment area of the material (202) to be treated. The means (210) for displacing may e.g. be a flow inlet system providing a flow of flow material (212) flowing substantially perpendicular to the direction of the plasma current in the part of the plasma (204) interacting with the material (202) to be treated. In this way efficient plasma treatment is obtained.
申请公布号 WO2006100030(A1) 申请公布日期 2006.09.28
申请号 WO2006EP02561 申请日期 2006.03.21
申请人 UNIVERSITEIT GENT;AKISHEV, YURI, S.;NAPARTOVICH, ANATOLY, P.;TRUSHKIN, NIKOLAY, I.;LEYS, CHRISTOPHE 发明人 AKISHEV, YURI, S.;NAPARTOVICH, ANATOLY, P.;TRUSHKIN, NIKOLAY, I.;LEYS, CHRISTOPHE
分类号 H05H1/24 主分类号 H05H1/24
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