THERMOPLASTIC MOLDING COMPOUNDS WITH INCREASED DIMENSIONAL STABILITY

摘要

The invention relates to thermoplastic molding compounds that contain A) 40 to 95 % by weight of a polyamide, B) 4 to 30 % by weight of an impact modifier polymer having functional groups, C) 1 to 50 % by weight of fibrous or particulate fillers or the mixtures thereof, D) 0 to 50 % by weight of other additives, the weight percentages of components A) to D) adding up to 100 %.