OPTICAL SEMICONDUCTOR DEVICE, LED HEAD, AND IMAGE FORMING APPARATUS EMPLOYING IT

摘要

PROBLEM TO BE SOLVED: To solve the problem of an optical semiconductor device wherein emission efficiency for taking out the light emitted in the device is reduced as the degree of integration of optical elements is increased because the light is intercepted by electrode wiring, and the like.

SOLUTION: A semiconductor thin film 12 is provided on a substrate 11 and, through the opening 14a of an interlayer insulation film 14 provided thereon, a transparent conductive film 15 coming into electrical contact with the uppermost contact layer 12d of the semiconductor thin film 12 is provided on the interlayer insulation film 14. A transparent conductive film 15 coming into contact with that transparent conductive film 15 is extended to the outside of a region for forming the semiconductor thin film 12, and the conduction layer 16 of a metal layer connected electrically with the transparent conductive film 15 is formed on the outside of that region.

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