| 摘要 |
An integrated circuit, comprising a plurality of interconnect lines each having a spacing and width, wherein the interconnect lines are formed with a mask (72), at least one of a contact and via connected to at least one of the interconnect lines, wherein the at least one contact and via has the same spacing and width as the interconnect lines, and wherein the contact or via is formed with the mask (72) used to form the interconnect lines. Also disclosed are methods for forming integrated circuits. |
