发明名称 A DEPOSITION SYSTEM AND METHOD
摘要 <p>A method for processing a substrate includes disposing the substrate in a deposition chamber configured to perform a deposition process and depositing a film on the substrate using the deposition process. The substrate having the film thereon is then transferred from the deposition chamber into a treatment chamber and a plasma cleaning process is performed on the substrate in the treatment chamber. Further processing of the substrate is performed after the plasma cleaning process.</p>
申请公布号 WO2006101619(A2) 申请公布日期 2006.09.28
申请号 WO2006US05016 申请日期 2006.02.14
申请人 TOKYO ELECTRON LIMITED;ISHIZAKA, TADAHIRO;LUDVIKSSON, AUDUNN 发明人 ISHIZAKA, TADAHIRO;LUDVIKSSON, AUDUNN
分类号 H01L21/44 主分类号 H01L21/44
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