发明名称 |
HEAT-SENSITIVE ADHESIVE AND HEAT-SENSITIVE ADHESIVE MATERIAL |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive having strong adhesive strength to a rough surface adherend such as corrugated cardboard; and to provide a heat-sensitive adhesive material. <P>SOLUTION: The heat-sensitive adhesive contains at least a thermoplastic resin and a hot-melt material which contains at least one kind selected from a compound represented by structural formula (I) (wherein, R<SP>1</SP>and R<SP>2</SP>are the same or different, and each a hydrogen atom or an alkyl group; and m and n are each an integer of 1-5). The heat-sensitive adhesive material has a heat-sensitive adhesive layer containing the heat-sensitive adhesive at least on one surface of a supporter. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006257163(A) |
申请公布日期 |
2006.09.28 |
申请号 |
JP20050073459 |
申请日期 |
2005.03.15 |
申请人 |
RICOH CO LTD |
发明人 |
GOTO HIROSHI;HAYAKAWA KUNIO;YAMAGUCHI TAKEHITO |
分类号 |
C09J201/00;B32B27/00;B41M5/00;B41M5/28;B41M5/30;B41M5/382;B41M5/40;B41M5/50;B41M5/52;C09J7/02;C09J11/06;G03G7/00 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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