发明名称 |
FILM APPLYING DEVICE AND FILM APPLYING METHOD |
摘要 |
<p>[PROBLEMS] A film applying device which is reduced in size in its entirety, which is easy to control, in which the time required for initial passing over and removal of a sheet is reduced, and which produces less debris. [MEANS FOR SOLVING PROBLEMS] A primary sheet (A) is paid out from a primary sheet support means, the paid out primary sheet (A) is once separated by a detour means into a film (A2) and a release sheet (A1), and the separated film (A2) is applied to an object (B). Then, after the applied film (A2) is cut out into a predetermined shape, it is rejoined to the release sheet (A1) and taken up together with the release sheet (A1).</p> |
申请公布号 |
WO2006100931(A1) |
申请公布日期 |
2006.09.28 |
申请号 |
WO2006JP304691 |
申请日期 |
2006.03.10 |
申请人 |
LINTEC CORPORATION;KOBAYASHI, KENJI;NAKADA, KAN;NONAKA, HIDEAKI |
发明人 |
KOBAYASHI, KENJI;NAKADA, KAN;NONAKA, HIDEAKI |
分类号 |
B65H39/16;B65H37/04;B65H41/00;H01L21/02 |
主分类号 |
B65H39/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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