SYSTEM IN PACKAGE OF SEPARATLY EMBEDING MODULE COMPONENTS IN MAIN BOARD AND PACKAGE BOARD

摘要

A system in package of separately embedding module components in a main board and a package board is provided to secure a space for inserting the components by resolving a density problem. At least one or more components are embedded in a core floor of a main board(230). A package board(210) is installed on a side of the main board. At least one second components are embedded in the core floor of the package board. The second components form a function module(200) by connecting electrically to the first components of the main board.