| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for mounting an optical communication module capable of attaining a low profile and to provide a mobile electronic apparatus using the same. <P>SOLUTION: In the structure A1 wherein an infrared ray data communication module D is mounted on a circuit board C including mount pads P, the infrared ray data communication module D being provided with a board 1 including mount terminals 11, a light receiving element and a light emitting element mounted on the board 1, and a resin package 5 for sealing the light receiving element and the light emitting element and with lens sections 51, 52 located in front of the light receiving element and the light emitting element, the circuit board C is provided with a recess Cd and at least part of the infrared ray data communication module D is contained in the recess Cd. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
