Semiconductor device for electronic device, has through contact arranged in prefabricated through contact flat rod, which is positioned in end region of device and exhibits through opening which is filled with metal

摘要

Device has a through contact (2) arranged in an end region (5) of the device. A semiconductor chip is partly embedded in a plastic frame ground (10). Contact surfaces (11) on an active topside of the chip stay in electrical communication with the contact, which is arranged in a prefabricated through contact flat rod (15). The rod is positioned in the end region, and exhibits a through opening (16) filled with metal. An independent claim is also included for a method for manufacturing a semiconductor device that includes a through contact.