TAKE UP DEVICE AND TAKE UP METHOD

摘要

[PROBLEMS] To provide a film take up device and a film take up method by which a film, which is cut to have a prescribed shape and has a narrow end section, can be smoothly taken up without wrinkles, and which are suitable for excellently adhering a film, such as a protection tape to be adhered on a semiconductor wafer, on a body whereupon the film is to be adhered, without wasting the film. [MEANS FOR SOLVING PROBLEMS] A detouring means is provided for temporarily separating an original film (A) wherein a strip-shaped film (A2) is temporarily adhered on a strip-shaped peeling sheet (A1) into the peeling sheet (A1) and the film (A2), and for bonding them again. The film (A2) separated by the detouring means is adhered on a body (B) whereupon the film is to be adhered, and a prescribed shape is cut out from the adhered film (A2). Then, prior to taking up the cut out film (A2) and the peeling sheet (A1) at the same time, the peeling sheet (A1) peeled by the detouring means is adhered so as to cover the cut out hole of the film (A2).