| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make a wiring board highly-reliable having the structure that a ceramic dielectric layer and a polymeric material dielectric layer are compositely laminated. <P>SOLUTION: A wiring board 1 has a substrate core 2 where a through-hole conductor 30 is formed inside. On the first and the second side of the substrate core 2, wiring laminated parts 66 and 7 are formed, respectively, on which a polymeric material dielectric layer and a conductive layer are laminated. Only on the first-side wiring laminated part 66 positioned on the first side, a capacitor is formed that includes a ceramic dielectric layer 5. The second-side wiring laminated layer 7 positioned on the second side has a smaller number of conductive layers compared to the first-side wiring laminated part 66, and has a polymeric material dielectric layer 33 at a layer level corresponding to the first-side composite laminated part 6 from the substrate core 2, whose thickness is increased more than that of the polymeric material dielectric layer 3A included in the composite laminated part 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
