The invention concerns a method for applying a surface modification agent composition for organosilicate glass dielectric films. More particularly, the invention pertains to a method for treating a silicate or organosilicate dielectric film on a substrate, which film either comprises silanol moieties or has had at least some previously present carbon containing moieties removed therefrom. The treatment adds carbon containing moieties to the film and/or seals surface pores of the film, when the film is porous.
申请公布号
WO2006101578(A1)
申请公布日期
2006.09.28
申请号
WO2006US01561
申请日期
2006.01.17
申请人
HONEYWELL INTERNATIONAL INC.;BHANAP, ANIL, S.;ILAN, GOLECKI;ENDISCH, DENIS, H.;DANIELS, BRIAN, J.;BURNHAM, KIKUE, S.;ROTH, ROBERT, R.