发明名称 |
Substrate processing system and method for manufacturing semiconductor device |
摘要 |
An object of the present invention is to completely remove water adhering to a substrate due to cleaning and carry the substrate with the water being removed, to a film forming unit. The present invention is a substrate processing system including: a cleaning unit for cleaning a substrate with a cleaning solution; a water removing unit for removing water adhering to the substrate cleaned in the cleaning unit; and a carrier section for carrying the substrate from which water has been removed in the water removing unit to another substrate processing unit through a dry atmosphere.
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申请公布号 |
US2006216948(A1) |
申请公布日期 |
2006.09.28 |
申请号 |
US20060547504 |
申请日期 |
2006.04.14 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
OHMI TADAHIRO;TERAMOTO AKINOBU |
分类号 |
H01L21/31;H01L21/677;H01L21/00;H01L21/304;H01L21/306;H01L21/469 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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