ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC CIRCUIT DEVICE

摘要

An electronic component mounting method includes a step of applying a resin composition (3), including a solder powder, a convection additive and a resin having fluidity at a melting temperature of the solder powder, on main plane of a wiring board (1) whereupon a conductor wiring and a connecting terminal are provided; a step of preparing an electronic component group composed of a plurality of electronic components (7, 8, 9) wherein at least one passive component is included and each electronic component is provided with an electrode terminal, aligning the connecting terminal with the electrode terminal, and abutting the electronic component group on a surface of the resin composition; a step of heating at least the resin composition to melt the solder powder and self-collect the solder powder between the connecting terminal and the electrode terminal by the convection additive and connecting the connecting terminal with the electrode terminal by soldering; and a step of bonding and fixing each electronic component group with the wiring board with the resin by hardening the resin in the resin composition. A mounting process can be remarkably simplified without previously forming a bump.