| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding pad having a metal pad in which a slot is formed and a mesh type via pattern. <P>SOLUTION: A bonding pad structure according to the present invention includes one of more insulator film patterns and/or conductive via patterns provided inside a region limited by the circumferential edge of a related main conductive film pattern. Such a pattern is subjected to offset between layers where the bonding pad structure continues by a fixed method and a resistant force of the bonding pad structure relating to mechanical and/or thermal stress is increased. The adhesive force of the bonding pad structure is improved and the frequency and the degree of separation, splitting, and peeling of various conductive layers and insulator films coupled to the bonding pad structure are relaxed. Conductive properties and insulation substances in a wider range are thereby used in the manufacture of the bonding pad structure and the operation properties and/or reliability is further improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
