发明名称 COOLING STRUCTURE, HEAT SINK, AND HEATER COOLING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure which is light in weight, compact in size, and is excellent in radiation characteristic, and a cooling method, to provide a heat sink which is excellent in radiation characteristic without enlarging the weight and volume of the heat sink, and to obtain the cooling structure which is light in weight, compact in size, and is excellent in radiation characteristic. SOLUTION: The cooling structure includes a radiation structure which has a heater 8 and the heat sink 7 composed of flexible metal foil bonded at least on the surface of heater 8 facing a cooling fluid 9 through an insulating adhesive layer 6, and a flow pass 5 which is located outside the radiation structure and located so that the cooling fluid 9 flowing inside and the heat sink 7 directly contact with each other. In addition, fine hollows 15 are formed on the surface of the heat sink directly contacting with the cooling fluid 9. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006261555(A) 申请公布日期 2006.09.28
申请号 JP20050079734 申请日期 2005.03.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 IPPOSHI SHIGETOSHI;YAMADA AKIRA;MAEKAWA HIROTOSHI;YABUNAKA FUMIHARU
分类号 H01L23/36 主分类号 H01L23/36
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