| 摘要 |
PROBLEM TO BE SOLVED: To provide a moisture-resistant structure which prevents the entry of moisture into a semiconductor chip and improves the reliability of the chip. SOLUTION: A semiconductor device (10) comprises a semiconductor substrate (11), a circuit formation area (A) on the semiconductor substrate, a moisture-resistant ring (12) which uses a wiring layer and surrounds the circuit formation area, and an impermeable protective film (19) which covers the moisture-resistant ring and the circuit formation area. The outermost surface of the moisture-resistant ring is directly covered with the impermeable protective film. The circuit formation area is covered with the impermeable protective film via a permeable protective film (15), the permeable protective film has an opening (29) which exposes the outermost surface of the moisture-resistant ring, and the outermost surface of the moisture-resistant ring is directly covered with the impermeable protective film in the opening. COPYRIGHT: (C)2006,JPO&NCIPI
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