| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component holding device which allows free exchange of an electronic component easily with a few components and is suitably reduced in size. SOLUTION: A CPU (electronic component) 30 is placed on a plurality of relay substrates 10, and a substrate 31 of the CPU 30 is held by elastic clips (holding mechanism) 18 formed in the relay substrates 10. Individual external connection electrodes 33 of the CPU 30 and individual lands 51 on a mother board 50 are electrically conduction-connected via elastic contacts 20A and 20B, connection lines 15a and 15b, and contacts 14A and 14B which are formed on the relay substrates 10. By bending the elastic clips 18 backward, the CPU 30 is be easily removed. By this structure, the electronic component holding device is provided which allows free and easy exchange of an electronic component with a few components and which is suitably reduced in size. COPYRIGHT: (C)2006,JPO&NCIPI
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