| 摘要 |
PROBLEM TO BE SOLVED: To provide a room temperature curing composition which cures in the presence of moisture by way of a pressure-sensitive adhesive matter. SOLUTION: The room temperature curing composition, containing (A) a reactive silicon group-containing oxyalkylene polymer, (B) a reactive silicon group-containing vinyl polymer, (C) an organotin compound and (D) an amino group-containing silane coupling agent, is characterized in that a content (% by mass) of the tin atom in the above composition relative to a methyl ethyl ketone-soluble component is of not less than the value of cSn<SB>1</SB>which is determined at the time of a coefficient k of 0.60 in formula (1): cSn<SB>1</SB>=k×(1-Y/S), wherein Y is a mass of the component insoluble in methyl ethyl ketone and S is a mass of the whole composition. COPYRIGHT: (C)2006,JPO&NCIPI
|
