Apparatus, system, and method for removing excess heat from a component

摘要

An apparatus, system, and method are disclosed for removing excess heat from a component. A heat sink is included and located in an area in a computer with excess cooling capacity. A heat pipe is included and is connected to the heat sink and extends to a heat sensitive component located in the computer. A heat conducting compliance pad is connected to the heat sensitive component. A heat conducting metallic connector is connected to the heat pipe and to the compliance pad.