发明名称 |
POLISHING APPARATUS AND A SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME |
摘要 |
The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities. <IMAGE> |
申请公布号 |
EP1125688(A4) |
申请公布日期 |
2006.09.27 |
申请号 |
EP19980950429 |
申请日期 |
1998.10.28 |
申请人 |
HITACHI, LTD. |
发明人 |
MORIYAMA, SHIGEO;ISHIDA, YOSHIHIRO;KUGAYA, TAKASHI;OOTSUKI, SHIGEO;KATAGIRI, SOICHI;NISHIMURA, SADAYUKI;KAWAI, RYOSEI;YASUI, KAN |
分类号 |
B24B37/04;B24B41/04;B24B53/007;B24B53/02;B24B53/12 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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