发明名称 Semiconductor device having stacked transistors and decoupling capacitors
摘要 <p>A semiconductor device having transistors formed on different layers of a stack structure includes a stacked capacitor cluster, wherein a stacked capacitor (C1,C2,C3) of the stacked capacitor cluster includes an insulation layer (40,50,61) of a transistor of the semiconductor device, and at least a first conduction layer and a second conduction layer (30,42,45,52,60,63) disposed above and below the insulation layer, wherein the stacked capacitor is a decoupling capacitor of the stacked capacitor cluster connected in parallel between a first line and a second line. The stack structure is used to form SRAM memory cells.</p>
申请公布号 EP1705693(A2) 申请公布日期 2006.09.27
申请号 EP20060005513 申请日期 2006.03.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YANG, HYANG-JA
分类号 H01L21/02;H01L21/8244;H01L23/522;H01L23/64;H01L27/06;H01L27/105;H01L27/108;H01L27/11 主分类号 H01L21/02
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