EPOXY-SILICONE HYBRID RESIN COMPOSITION, PROCESS FOR THE PREPARATION THEREOF AND LIGHT-EMITTING SEMICONDUCTOR DEVICE

摘要

The epoxy-silicone hybrid resin composition comprises, as the essential components, (A') an organosilicon compound having one or more aliphatic unsaturated monovalent hydrocarbon groups in one molecule and having at least one silicon atom-bonded hydroxy group, (B) an aromatic epoxy resin having >=250 epoxy equivalent or a hydrogenated epoxy resin in which an aromatic ring is partially or completely hydrogenated, (C) organohydrogen polysiloxane, (D) a platinum group metal catalyst, (E) an aluminum-based curing catalyst and (F) an acyclic low-viscosity liquid epoxy resin having <=50 mPa s viscosity at 25 DEG C. The present invention provides an epoxy-silicone hybrid resin composition capable of providing a light emitting semiconductor device covered and protected with the cured product and excellent in longer life and energy saving because of little discoloration by a heat test and higher light emitting efficiency and having considerable merit on industries thereby.