METHOD FOR FORMING VIA ELECTRODE OF CERAMIC PACKAGE USING METAL MASK

摘要

A method for forming a via electrode of ceramic package using a metal mask is provided to secure normal operation by preventing short between the via electrode and a metal pattern. A via hole(42) is formed on a ceramic sheet(40). A metal mask having a first hole is located on the ceramic sheet. A flexible polymer sheet having a second hole is located between the metal mask and the ceramic sheet. A conductive material for forming a via electrode is filled in the via hole through the first hole and the second hole. A via electrode(43a) is formed by removing the metal mask including the flexible polymer sheet.