发明名称 |
DEVICE FOR BONDING SUBSTRATES |
摘要 |
<p>In order to ensure simultaneous rotation of two substrates during boding in a simple and economical manner, the invention provides a device for bonding two substrates having one inner hole to a substrate disc. Said device comprises a first holding device (55) to hold the first substrate, a centering pin that is connected in a rotationally fixed manner to the first holding device (84) and that can be inserted into the inner hole of at least the first substrate, in addition to a drive mechanism for rotating the centering pin (1) and the first holding device. The invention is characterized by a driver (20) that can be engaged with the centering pin (1) and a second holding device to hold the second substrate, which is connected to the driver (20) in a rotationally fixed manner.</p> |
申请公布号 |
EP1430479(B1) |
申请公布日期 |
2006.09.27 |
申请号 |
EP20020732691 |
申请日期 |
2002.05.02 |
申请人 |
STEAG HAMATECH AG |
发明人 |
LEONHARDT, STEPHAN;GUECLUE, ILHAN;WINTER, MARC |
分类号 |
G11B7/26;B29C65/48;G11B7/24 |
主分类号 |
G11B7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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