| 发明名称 |
DICING/DIE BONDING FILM AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A dicing/die bonding sheet is made by joining a base film ( 1 ) and a silicone based adhesive agent layer ( 3 ) through the medium of an undercoat layer ( 2 ). This all-in-one dicing/die bonding sheet exhibits superior long-term storage stability and prevents chip delamination during dicing. |
| 申请公布号 |
EP1704591(A1) |
申请公布日期 |
2006.09.27 |
| 申请号 |
EP20040801677 |
申请日期 |
2004.12.07 |
| 申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
SUTOH, MANABU;USHIO, YOSHITO |
| 分类号 |
C09J7/02;H01L21/68;C09D5/00;C09D201/00;C09J183/04;H01L21/00;H01L21/301;H01L21/58 |
主分类号 |
C09J7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
