METHOD FOR DECHUCKING SUBSTRATE FROM ESC

摘要

A substrate dechucking method is provided to prevent the damage of a substrate by checking exactly an electrostatic force release point and to reduce a processing time by releasing completely an electrostatic force in a short time. A DC(Direct Current) power source supplied to a predetermined electrode of an electrostatic chuck is stopped(S120). The pressure of cooling gas between the electrostatic chuck and a substrate is set to a first pressure value. The cooling gas is continuously supplied to keep the first pressure value and the flow rate of the cooling gas is measured(S130). When the flow rate of the cooling gas reaches a critical flow rate, the pressure of the cooling gas is reset from the first pressure value to a second pressure value. The cooling gas is continuously supplied to keep the second pressure value and the flow rate of the cooling gas is measured(S140). The substrate is unloaded from the electrostatic chuck when the flow rate of the cooling gas is below the critical flow rate.