| 摘要 |
A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-metal connections in order to provide a plastic leadframe package structure that includes electronic circuitry thereon. The plurality of conductive components can be configured as discrete components, while the die itself can be configured as a Flip Chip On Plastic Leadframe component. By utilizing plastic as the basis for a substrate and, ultrasonic bonding of the metal-to-metal connections, a complex substrate formed from plastic can provide a structure, particularly a plastic leadframe structure, that allows for the use of parts and components that are much less expensive than presently utilized parts and components.
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