METHOD OF ATTACHING NON-ADHESIVE THERMAL INTERFACE MATERIALS

摘要

Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.