Pretreatment for an electroplating process and an electroplating process in including the pretreatment

摘要

The present invention provides an electroplating process and a method for manufacturing an integrated circuit. The electroplating process includes, among other steps, placing a substrate 290 in an enclosure 200 being substantially devoid of unwanted contaminants and forming a material layer 310 over the substrate 290 within the enclosure 200, the enclosure 200 still being substantially devoid of the unwanted contaminants. The electroplating process further includes forming a thin layer of oxide 410 over the material layer 310 within the enclosure 200 , the enclosure 200 still being substantially devoid of the unwanted contaminants during the forming the thin layer of oxide 410.