发明名称 Methods of forming materials between conductive electrical components, and insulating materials
摘要 Methods of forming insulating materials between conductive elements include forming a material adjacent a conductive electrical component comprising: partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. Other methods include forming a material between a pair of conductive electrical components comprising: forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. Some embodiments include an insulating material adjacent a conductive electrical component, such material comprising a matrix and at least one void within the matrix.
申请公布号 US7112542(B2) 申请公布日期 2006.09.26
申请号 US20020330719 申请日期 2002.12.27
申请人 MICRON TECHNOLOGY, INC. 发明人 JUENGLING WERNER;PRALL KIRK D.;IYER RAVI;SANDHU GURTEJ S.;BLALOCK GUY
分类号 H01L21/31;H01L21/316;H01L21/469;H01L21/76;H01L21/768;H01L23/522;H01L23/532 主分类号 H01L21/31
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