发明名称 |
Methods of forming materials between conductive electrical components, and insulating materials |
摘要 |
Methods of forming insulating materials between conductive elements include forming a material adjacent a conductive electrical component comprising: partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. Other methods include forming a material between a pair of conductive electrical components comprising: forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. Some embodiments include an insulating material adjacent a conductive electrical component, such material comprising a matrix and at least one void within the matrix.
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申请公布号 |
US7112542(B2) |
申请公布日期 |
2006.09.26 |
申请号 |
US20020330719 |
申请日期 |
2002.12.27 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
JUENGLING WERNER;PRALL KIRK D.;IYER RAVI;SANDHU GURTEJ S.;BLALOCK GUY |
分类号 |
H01L21/31;H01L21/316;H01L21/469;H01L21/76;H01L21/768;H01L23/522;H01L23/532 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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