| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device which stabilizes suction and mountability when mounting the optical semiconductor device and ensures positioning onto the board of a device as well as mounting, and which can surely adhere a shield case, and to provide an electronic apparatus to which the optical semiconductor device is mounted and a method for manufacturing the optical semiconductor device. <P>SOLUTION: A resin forming part 5 is provided with a first projecting forming part 17 which is projected and extended from a first inclined part 11, and a second projecting forming part 18 which is projected and extended from a second inclined part 12. The first and second projecting forming parts 17 and 18 are diced at a dicing line DL in the same manner as a wiring board 1, thereby forming a first projection 17b in the first inclined part 11 and a second projection 18b in the second inclined part 12, respectively. The first and second projections 17b and 18b are provided with flat parts 17s and 18s that are in the vertical direction to the plane of the wiring board 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
