| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To facilitate a mounting process of a semiconductor device having a composite power MOSFET. <P>SOLUTION: In a structure where a chip 4C1 having a power MOS circuit section on the high side, and a chip 4C2 having a power MOS circuit section on the low side are contained in a sealed body 1, the width of leads 2 to which drain electrodes of the power MOS circuit sections on the high and low sides are connected, is made to be wide, and each of which protrudes from both long sides of the sealed body 1 so as to be asymmetric each other. A lead bar 8c and a chip mounting part 6b are separated each other. Consequently, a straight pattern part containing the lead bar 8c and the chip mounting part 6b can have high accuracy of flatness. Moreover, since the straight pattern part containing the lead bar 8c and the chip mounting part 6b can reduce bending of the sealed body 1 due to the stress when the chips 4C1 and 4C2 are sealed, peeling of the sealed body 1 can be avoided. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
