| 摘要 |
PROBLEM TO BE SOLVED: To provide a far infrared radiation cooling device having higher radiation cooling performance than conventional one. SOLUTION: The far infrared radiation cooling device 10 comprises a far infrared radiation layer 16 formed of a fine crystal grain aggregate of a far infrared radiation material and provided on the surface of a heat transfer member 14. Thus, heat conducted from a semiconductor 12 is radiated as radiation energy from the far infrared radiation layer 16. The far infrared radiation layer 16 develops high radiation cooling performance without the need for a binder or a base material formed of a material having low far infrared radiation capability. COPYRIGHT: (C)2006,JPO&NCIPI |
