FLEXIBLE SUBSTRATE FOR COF, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a flexible substrate for COF which can be suitably used for the formation of the mounting circuit of high integration degree, and to provide an electronic component mounted by the COF system using the flexible substrate for COF. SOLUTION: The flexible substrate for COF is prepared by directly laminating a copper layer of the thickness of 1-9μm and a polyimide film layer 2 of the thickness of 10-100μm. The electronic component comprises as follows. An IC chip 4 is mounted leaving a gap section between the chip and the front face of the flexible substrate for COF. In addition, the void section is filled up with an underfill material and cured. COPYRIGHT: (C)2006,JPO&NCIPI