| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing piezo-oscillators, in which a thin area is formed on a conductive metal plate and then it is removed after resin sealing to reduce contribution to the thickness of a piezo-oscillator on the conductive metal plate, and to make it thinner. SOLUTION: The production method has a metal plate machining process for forming an oscillator mounting part 20 which is provided with the thin section 44 on the conductive metal plate 40 and mounted with the piezo-oscillator, and a plurality of mounting terminals 22 which are to be connected to a mounting board so as to be convex shaped; an oscillator mounting process to place the piezo-oscillator 12 on the oscillator mounting part 20; and a chip-mounting process for fixing a semiconductor chip 24 which is provided with a circuit for energizing the piezo-oscillator on the piezo-oscillator 12. In addition, the production method also has a wire-bonding process for electrically connecting the semiconductor chip 24, the piezo-oscillator 12, and the mounting terminal parts 22; a sealing process for resin-sealing the semiconductor chip 24, the piezo-oscillator 12, and the convex-shaped mounting terminal parts 22; and a terminal separation process for removing the thin area 44 from the conductive metal plate 40. COPYRIGHT: (C)2006,JPO&NCIPI
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