发明名称 TEMPERATURE MEASUREMENT APPARATUS FOR WAFER HOLDER, AND WAFER HOLDER
摘要 PROBLEM TO BE SOLVED: To provide a temperature measurement apparatus with excellent temperature measurement accuracy that does not need to be exchanged as a whole even if a temperature measurement device is damaged, and a wafer holder using it. SOLUTION: A temperature measurement device 1 is inserted into the bottom owner section 11a of a tubular body 11 with a bottom. At least the external surface of a section 11a with a bottom is contacted with the wafer heating surface of a wafer holder 3 and the rear surface of the opposite side or a recess arranged on the rear side, while a tube 11b on the opposite side of the tubular body 11 with the bottom and reaction vessel 4 are hermetically sealed by an O-ring 5. Preferably, the contact area of the tubular body 11 with the bottom and wafer holder 3 must be no less than 10 mm<SP>2</SP>, the parallelism of mutual contact surfaces must be no more than 100μm, and the relative roughness of the contact surfaces must be no more than 5μm in Ra. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006253723(A) 申请公布日期 2006.09.21
申请号 JP20060159025 申请日期 2006.06.07
申请人 SUMITOMO ELECTRIC IND LTD 发明人 HASHIKURA MANABU;NAKADA HIROHIKO;NATSUHARA MASUHIRO;HIIRAGIDAIRA HIROSHI
分类号 H01L21/02;G01K1/14 主分类号 H01L21/02
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