| 摘要 |
PROBLEM TO BE SOLVED: To equalize temperature distribution in an electronic apparatus such as a folding type cellular phone. SOLUTION: An heat dissipating structure dissipates the heat generated in a first casing 100A in the electronic apparatus 100 provided with first and second casings 100A, 100B rotatably coupled with each other via a hinge mechanism 100C to the second casing 100B. The structure is provided with a first heat pipe 6 disposed inside the first casing 100A, and a second heat pipe 8 disposed inside the second casing 100B. The structure is provided with a flexible thermal conducting member 7 for coupling the first and second heat pipes 6 and 8 through the inside of the hinge mechanism 100C. COPYRIGHT: (C)2006,JPO&NCIPI
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